https://focustaiwan.tw/sci-tech/202208300030
TSMC touts its 2nm process as best technology in world
08/30/2022 09:29 PM
TSMC. CNA file photo.
Taipei, Aug. 30 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) touted its advanced 2 nanometer process on Tuesday as the industry's best and most efficient technology after it becomes used for mass production in 2025.
TSMC CEO C.C. Wei (魏哲家) confirmed at the chipmaker's technology symposium held in Hsinchu that mass production using the firm's 2nm process would start in 2025.
TSMC's rivals U.S.-based Intel Corp. and South Korea's Samsung Electronics Co. are also planning to roll out chips made on the 2nm process between 2024 and 2025.
According to TSMC, the 2nm process will use the sophisticated Gate-All-Around (GAA) structure, which will reduce undesirable variability and mobility loss and make the technology the most competitive and efficient on the market.
TSMC is planning to build a wafer fab using the 2nm process in Hsinchu in northern Taiwan, and is likely to expand the technology to Taichung in central Taiwan.
Before the launch of the 2nm process, TSMC will launch commercial production of chips made on the 3nm process soon, after having begun trial production of the 3nm process last year.
The 3nm process uses the FinField-effect-transistor (FinFET) technology, a 3D transistor structure that allows a chip to run faster using the same amount of power or to run at the same speed on reduced power.
Wei said TSMC had encountered many difficulties in developing the 3nm process, but would now begin the mass production stage soon with many of its clients showing enthusiasm in working with the chipmaker.
International news media reported Apple Inc. will adopt TSMC's 3nm process when it rolls out the new Macbook series.
According to Wei, TSMC has more than 2,000 R&D design specialists with a lot of expertise, but the company will never compete with its clients by marketing its own designs but will only cooperate with its customers and provide necessary assistance.
Also attending the TSMC technology symposium was J.C. Hsu (徐敬全), corporate vice president and general manager of IC designer MediaTek Inc.'s wireless communications business unit, who said his company had adopted TSMC's 4nm process to produce the flagship Dimensity 5G Smartphone platform and would continue to closely work with the chipmaker.
Y.L. Wang (王英郎), vice president for TSMC's Operations/Fab Operations I, said the chipmaker had been keen to expand its production and would see three new plants start commercial production in 2024 -- one in the United States, one in Japan, and one in Kaohsiung.
Wang said the fab in the U.S. state of Arizona was under construction and was scheduled to produce chips made on the 5nm process in 2024, while its fab in Japan, which is also under construction, would roll out specialty chips using the company's mature 22 nm and 28nm specialty technologies.
The Kaohsiung fab is scheduled to break ground later this year and will use the 7nm and 28nm processes to produce chips in 2024, according to Wang.
(By Chang Chien-chung and Frances Huang)
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